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    DFN



    Product Overview
    Middle voltage(200~650V）package: DFN3.3x3.3, DFN5.15x6.15, DFN8x8.
    Application
    Automotive, Energy, Transportation, Industrial, Home appliances.
    Features
    JEDEC standard outlines or customized outlines.

    Single / dual gauge, stamping / etching lead frame.

    Solder wire, Solder paste, Screen printing, Epoxy, DAF die bond technology.

    Al wire, Ribbon, Clip, Cu wire, Au wire bond technology.

    Green mold compound molding technology.

    100% Sn plating technology.
    Reliability
    MSL1 (For SMT Package) ：Bake 125°C/24H, Monisture soak 85°C/85%RH/168H, Reflow 3 times with 260°C.

    Uhast : 96Hur / PCT96Hur: 121°C/100%RH.

    TC1000: -55°C/150°C.

    HTRB1000Hur: 150°/ 175°C.

    HTGB1000Hur: 150°/ 175°C.

    H3THR1000Hur: 85°C/85%RH, 80% VR.
    Package Offering
    Au, Cu wire diameter 0.8~2mil.

    Ribbon 20*4~80*6mil.

    Customized clip base on die pad.




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